Schematic Capture
原理图设计
- Multi-sheet hierarchical schematics with clear module boundaries
- ERC with every violation cleared
- A single symbol and footprint library
- BOM versioned alongside the schematic
PCB Solution Design
Your PCB design,
Your PCB design,
production-ready
Schematic capture, stackup and layout, DFM review with signal-integrity simulation, and the complete release package — handled by one team, so nobody re-explains your requirements between suppliers.
- NDA signed
- Source files handed over
- DFM on every board
- Major EDA platforms
Stackup
Signal layers paired with reference planes; power and ground partitioned deliberately
Impedance
50Ω single-ended and 100Ω differential as targets, verified against your fab stackup
DRC
Rules set to IPC-2221 and your fab's process window, cleared item by item
Release
Gerber · Drill · Pick & Place · Stencil · Assembly · BOM · 3D · Source files
2018
Founded in Shenzhen, serving hardware R&D teams
08
Industry solutions covered
06
Core design disciplines
05
Stages in a standard release
IPC-2221IPC-A-610IPC-7351Altium DesignerCadence AllegroOrCAD CapturePADSXpeditionKiCadBlind & Buried Via HDIRigid-FlexHigh-Speed SerDesImpedance ControlStackup EngineeringDFM / DRCSignal Integrity SimulationIPC-2221IPC-A-610IPC-7351Altium DesignerCadence AllegroOrCAD CapturePADSXpeditionKiCadBlind & Buried Via HDIRigid-FlexHigh-Speed SerDesImpedance ControlStackup EngineeringDFM / DRCSignal Integrity Simulation
SERVICE CHAIN
01 — Service Chain
Six stages, with no loose ends between them
Every stage has a defined input, output and deliverable, so you always know where the project stands and what lands next.
STEP 01
Requirement & Component Review
We read your specification, schematic, BOM and mechanical outline, then assess feasibility, process route and risk.
DELIVERABLE · Technical assessment + quotation
STEP 02
Schematic Capture
Modular multi-sheet schematics, ERC verification, one symbol and footprint library, BOM kept in step with the drawing.
DELIVERABLE · Schematic source + BOM
STEP 03
Stackup & PCB Layout
Stackup planning, impedance control, length matching, plane partitioning and continuous return paths.
DELIVERABLE · PCB source + stackup table
STEP 04
DFM & Simulation
DRC, impedance verification, process-capability checks and assembly review, with SI/PI and thermal simulation where it matters.
DELIVERABLE · DRC / DFM report + simulation data
STEP 05
Production Release
Gerber, drill, pick-and-place, stencil, assembly drawings and 3D in your fab's format, with design source files transferred.
DELIVERABLE · Full production package + assembly data
STEP 06
Prototype & Ramp-up
We support the prototype build and pilot run, and feed fab and assembler feedback into the next revision of the layout.
DELIVERABLE · Revision guidance + production files
CORE CAPABILITIES
02 — Capabilities
Six disciplines, one design chain
Everything from schematic capture to complex boards, combined according to the shape of your product.
PCB Layout & Stackup
PCB Layout 与叠层
- Stackup built around signal types
- Consistent single-ended and differential impedance targets
- Length matching and topology on high-speed buses
- Plane partitioning with continuous return paths
High-Speed & SerDes
高速与 SerDes
- Constraint-driven routing for DDR, PCIe, USB and Ethernet
- Reference-plane continuity by design
- SerDes topology and termination strategy
- Via and reference-plane crossing handling
HDI & Microvia
HDI 与高密度互连
- Blind, buried and any-layer interconnect
- Via-in-pad and fine-pitch BGA breakout
- High-density placement for miniaturised products
- Via stack orders matched to your fab's process
RF & Mixed-Signal
射频与混合信号
- Low-loss laminates and tuned transmission lines
- Analogue-digital partitioning and ground isolation
- RF routing and matching networks
- Antenna keep-out and feed-line detours
Rigid-Flex & Power
刚柔结合与电源
- Bend radius and dynamic flex zones
- Rigid-flex stackup and mechanical lamination
- PDN decoupling strategy and current paths
- Thermal placement and heat spreading
INDUSTRY SOLUTIONS
03 — Industries
Eight industries, eight different review priorities
Reliability, process and verification demands differ by field. We organise design review and verification around what your sector actually cares about.
Industrial
Industrial Control
工控与自动化
PLC mainboards, servo drives, I/O expansion and communications modules.
Review focus Power integrity, EMC margin, stability over long duty cycles
Medical
Medical Devices
医疗设备
Patient monitors, diagnostic equipment and portable medical terminals.
Review focus Isolation, ESD protection, traceable documentation
Automotive
Automotive
汽车电子
Body control, motor control, T-Box communications and sensor nodes.
Review focus Temperature range, vibration margin, long-term component availability
New Energy
EV & Charging
新能源与充电
Charger controllers, BMS boards and energy-storage control units.
Review focus High-current paths, thermal management, isolation and hi-pot
Instrument
Instrumentation
仪器仪表
Oscilloscopes, RF test equipment and calibration rigs.
Review focus Analogue accuracy, noise rejection, grounding and shielding
UAV & Robot
UAV & Robotics
无人机与机器人
Flight control, video link, drive and sensor nodes.
Review focus Weight, vibration tolerance, density in a tight envelope
IoT
IoT & Communication
IoT 与通信
Wireless modules, gateways, LoRa and cellular terminals.
Review focus RF layout, antenna keep-out, system power budget
Consumer
Consumer Electronics
消费电子
Wearables, audio, small appliances and personal-device control boards.
Review focus Cost, build consistency, form-factor miniaturisation
DELIVERY PROCESS
04 — Process
Five stages, each with a named deliverable
Deliverables and acceptance criteria are agreed before the project starts, so nothing turns up missing halfway through.
Phase 01
Requirement Review
You send requirements, schematic, BOM and mechanical outline; we come back with a technical assessment, proposed approach and quotation.
OUTPUTTechnical assessment · Quotation
Phase 02
Design
Stackup, layout and schematic cleanup move together, with checkpoints agreed before the next stage begins.
OUTPUTStackup table · Layout source · Schematic
Phase 03
Verification
DRC, DFM and impedance checks line by line, plus SI/PI and thermal simulation where it matters, so problems surface before the prototype.
OUTPUTDRC / DFM report · Simulation data
Phase 04
Release
The complete production package and assembly documentation, with design source files handed over. The design stays yours.
OUTPUTGerber · Drill · Pick & Place · Stencil · Assembly · 3D
Phase 05
Ramp-up
Support prototype and pilot builds, track fab and assembler feedback, and close revisions before they reach production.
OUTPUTRevision guidance · Production files
WHY US
05 — Why Us
Design risk belongs in the design phase
Finding the problem after the prototype comes back — then waiting another two weeks for a revision — is the outcome we work hardest to prevent.
D-01
One team, start to finish
Schematic, layout, process and documentation stay in one place. Your requirements are not re-explained at every handover.
D-02
Designed backwards from manufacturability
Stackup, process window, board thickness and assembly method shape the layout, instead of arguing process limits with the fab afterwards.
D-03
Source files handed over in full
Production data, assembly documentation and design sources transfer to you. The design is yours to modify or take elsewhere.
D-04
Engineering language, no translation loss
Impedance, length matching, component substitution and process limits get discussed in the same engineering terms on both sides.
FAQ
06 — FAQ
Questions engineers ask us first
The things that usually come up while you are choosing a design partner.
Q1What do you need from me to start?
At minimum: a functional and performance description, the schematic if it exists, a BOM, a mechanical outline or dimensions (DXF/STEP), and any layer-count, process or interface requirements. If something is missing we complete the assessment first, then quote once the approach is agreed.
Q2How is the price calculated?
Mainly layer count, pin count and routing difficulty (high-speed, blind and buried vias, analogue sections), stackup and material requirements, the scope of deliverables and your schedule. You get an itemised quote, and no opaque extras appear later.
Q3Which files do I receive?
Production data (Gerber, drill, pick-and-place, stencil), assembly documentation (assembly drawings, silkscreen reference, 3D model), the BOM, and the design source files (schematic and PCB) — delivered in your EDA platform of choice.
Q4Which EDA tools do you work in?
Altium Designer, Cadence Allegro / OrCAD, PADS, Xpedition and KiCad among others, chosen to match the conventions and libraries your team already uses.
Q5Who owns the source files?
You do. The schematic and PCB sources transfer with the release under a non-disclosure agreement. Your own team can continue from there, or we can.
Q6Do you also handle prototypes and production?
We can. Solution design is our main line, and we can extend to prototyping, SMT assembly and component supply so you end up with a working unit. If you already have preferred partners, we can design only and work alongside them.
CONTACT
07 — Contact
Send the requirement, get a technical read first
No need to talk price up front. Describe the product and its constraints, and we reply with feasibility and a recommended approach.