Industrial
Industrial gateway mainboard
6 layers, DDR3 + 4× CAN + dual Ethernet
Continuous operation across a wide temperature range with too little EMC margin, and digital noise bleeding into analogue.
How we approach it Separate strong and weak domains with a dedicated analogue ground, isolate and filter the interfaces, and reset DRC against the fab's real trace widths.
Process notes Partitioning and isolation
Board and stackup 6 layers, DDR3 + 4× CAN + dual Ethernet
Industrial
Servo drive control board
8 layers, high-power devices with current sensing
Concentrated heat in the current paths, and switching noise corrupting the current sensing.
How we approach it Size current paths for temperature rise across copper weight and parallel runs, spread the heat sources to match the enclosure airflow, and keep sense loops clear of power loops.
Process notes High current and thermal
Board and stackup 8 layers, high-power devices with current sensing
Medical
Patient monitor mainboard
8 layers, low-noise analogue front end with isolated supply
Weak physiological signals buried under digital and supply noise, with isolation spacing short of the safety requirement.
How we approach it Isolate and shield the analogue front end with short parallel routing, verify isolation spacing against the standard, and record it in the verification report.
Process notes Analogue noise and isolation
Board and stackup 8 layers, low-noise analogue front end with isolated supply
Medical
Portable therapy terminal
4 layers, battery powered with wireless
Battery life, safety spacing and a tight form factor all have to hold at the same time.
How we approach it Plan the quiescent current paths by section, check clearances against the working voltage and the relevant safety standard, and prefer packages that keep the board small.
Process notes Power budget and safety
Board and stackup 4 layers, battery powered with wireless
EV
Charger controller board
6 layers, three-phase sensing with relay drive
Heating at the high-current contacts, with a dependable isolation barrier and creepage distance between HV and LV.
How we approach it Align the current path and the contact thermal path, handle the isolation barrier explicitly, and verify spacing against the working voltage.
Process notes High current and creepage
Board and stackup 6 layers, three-phase sensing with relay drive
EV
Battery management board
4 layers, multi-channel sensing with balancing
Channels interfering with each other, with accuracy drifting with temperature and load.
How we approach it Route sense pairs differentially away from digital and power sections, converge the ground reference at a single point, and select parts for the temperature range.
Process notes Sense accuracy
Board and stackup 4 layers, multi-channel sensing with balancing
Automotive
T-Box communications module
8 layers, cellular + GNSS + CAN
A wide vehicle temperature envelope, with vibration and shock as normal operating conditions.
How we approach it Derate components for the vehicle environment, anchor and isolate vibration-sensitive parts, and leave room for assembly and rework in the structural interface.
Process notes Temperature and vibration
Board and stackup 8 layers, cellular + GNSS + CAN
Automotive
Body control unit
6 layers, CAN + LIN + diagnostics
A long production run where critical parts need a stable second source.
How we approach it Mark alternates at critical positions with the conditions for using them, prefer long-term-available devices, and keep package orientation consistent for the line.
Process notes Automotive process and availability
Board and stackup 6 layers, CAN + LIN + diagnostics
IoT
5G industrial gateway
10 layers, SerDes alongside an RF front end
High-speed interfaces and RF on one board, both of which suffer when the reference plane is broken.
How we approach it Partition deliberately and keep reference planes continuous, route RF to impedance with strict antenna keep-out, and run SI simulation where it matters.
Process notes Signal integrity and RF coexistence
Board and stackup 10 layers, SerDes alongside an RF front end
IoT
Smart home control panel
4 layers, wireless + touch + power
Wireless transmission next to a switching supply, with both radiated and conducted risk to manage.
How we approach it Separate the wireless and power sections, place filtering close to the source, and surround the touch routing while keeping it away from the mains area.
Process notes EMC and safety
Board and stackup 4 layers, wireless + touch + power
Instrumentation
Oscilloscope front-end board
6 layers, high-speed analogue with triggering
Push the bandwidth figure and the noise comes with it; front-end layout sets the ceiling.
How we approach it Keep the analogue front end short, direct and parallel away from interference sources, plan ground planes around signal flow, and reserve test points at key nodes.
Process notes Bandwidth and noise
Board and stackup 6 layers, high-speed analogue with triggering
UAV
Combined flight control and video link
6-layer HDI, IMU with motor drive
A hard weight ceiling, with motor noise landing straight on the IMU samples.
How we approach it Trade stackup and material for weight, isolate and stiffen the IMU area, and handle drive noise and ground returns separately.
Process notes Vibration and weight
Board and stackup 6-layer HDI, IMU with motor drive
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